JPH0356069Y2 - - Google Patents
Info
- Publication number
- JPH0356069Y2 JPH0356069Y2 JP17947685U JP17947685U JPH0356069Y2 JP H0356069 Y2 JPH0356069 Y2 JP H0356069Y2 JP 17947685 U JP17947685 U JP 17947685U JP 17947685 U JP17947685 U JP 17947685U JP H0356069 Y2 JPH0356069 Y2 JP H0356069Y2
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- film carrier
- chip
- present
- hereinafter referred
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17947685U JPH0356069Y2 (en]) | 1985-11-21 | 1985-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17947685U JPH0356069Y2 (en]) | 1985-11-21 | 1985-11-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6287480U JPS6287480U (en]) | 1987-06-04 |
| JPH0356069Y2 true JPH0356069Y2 (en]) | 1991-12-16 |
Family
ID=31122572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17947685U Expired JPH0356069Y2 (en]) | 1985-11-21 | 1985-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356069Y2 (en]) |
-
1985
- 1985-11-21 JP JP17947685U patent/JPH0356069Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6287480U (en]) | 1987-06-04 |
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